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DLA Land and Maritime Organizational Chart
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Director

Email:    DLAPTC@dla.mil

Address:
DLA Land and Maritime - T
Product Test Center
3990 East Broad Street
Bldg 9, Section 1
PO Box 3990
Columbus, OH 43218-3990

Phone:

Mechanical PTC Lab Manager

Email:  MPTC@dla.mil

Address:
DLA Land and Maritime - VTM
Product Test Center - Mechanical
3990 East Broad Street,
Bldg 9, Sections 1 & 2
PO Box 3990
Columbus, OH 43218-3990

Phone:

Electronics PTC Lab Manager

Email: EPTC@dla.mil

Address:
DLA Land and Maritime - VTA and VTP
Product Test Center - Electronics
3990 East Broad Street,
Bldg 11, Section 7
PO Box 3990
Columbus, OH  43218-3990

Phone:

Land and Maritime Product Test Center

Serving the testing needs of DLA, DOD, and now the private sector.   Product Test Center Logo. Has Defense Logistics Agency written in red at the top. A large gold PTC in the middle on top of a obtuse triangle and a Product Testing Center on a blue block background at the bottom.

The Defense Logistics Agency's Product Testing Center is a full-service, customer-focused testing facility with the capability to satisfy the requirements of a broad range of military and commercial applications in a reliable, cost-effective, and timely manner.

Please send all comments on test reports and the PTC webpages to PTC.comments.dscc@dla.mil

Mission Statement

The Product Testing Center Director acts as the Defense Logistics Agency's (DLA) Executive Agent for all Product Testing Centers (PTC) and reports to the Commander of DLA Land and Maritime. Manages three Product Testing Centers that perform professional scientific evaluations of products and related services, including product testing, technical support, and training for customers in a timely manner. Responsible for achieving overall strategic planning effectiveness to include creating a market responsive organization, customer service strategies, defining market boundaries, business pricing strategies to fulfill agency needs for testing services, and ample resources to ensure product quality, customer satisfaction, and meeting time commitments. Responsible to ensure performance can be measured through effective and efficient workload metrics to assure cost recovery, and improve technical development to increase efficiency and customer satisfaction.

  • The Electronic Product Test Center in Columbus, OH, is co-located with DLA Land and Maritime to fulfill electronics testing requirements for the Inventory Control Point.
  • The Mechanical Product Test Center in Columbus, OH, is co-located with DLA Land and Maritime to fulfill mechanical testing requirements for the Inventory Control Point.
     
  • The Analytical Product Test Center in Philadelphia, PA, is co-located with DLA Troop Support.

Organizational Statement

DLA's Product Testing Center consists of three modern testing facilities, located nationwide, which offer over 100 years of combined testing experience as your front-line defense for quality and reliability. The three test sites are stationed at major DLA Inventory Control Points for close working relationships with supply planners and product specialists.

Mechanical Product Testing Center

Mechanical Testing

A broad category of testing intended to verify that the physical properties of an item meet the requirements specified.  Specific types or capabilities of mechanical testing include:

  • METROLOGY dimensional and microscopic surface measurement to verify that the physical form of an item meets requirements defined by a drawing or other technical reference document.
  • PERFORMANCE TESTING - tests designed to validate the performance of items.  Performance testing can also be used replicate service conditions, such as elevated temperatures, pressures.
  • METALLURGICAL - complete wet and dry chemical composition, instrumental analysis of alloys, microstructure analysis, and hardness using a wide variety of metallurgical testing equipment.
  • NONDESTRUCTIVE TESTING tests performed on a component that do not alter the physical state or destroy the item. Commonly utilized to detect cracks, voids, and other defects in a material using methods such as scanning electron microscopy, radiography, and magnetic particle testers.  MPTC currently offers this testing via a reliable third-party contractor.

Metrology (Equipment)

Dimensional and microscopic surface measurements utilizing instrumentation such as coordinate measuring machines, optical measuring machines, circular geometry machinery, optical comparators, and a variety of other free standing and hand-held measuring equipment.

  • Circular Geometry Machinery
  • Coordinate Measuring Machines
  • Handheld Test Measurement & Diagnostic Equipment (TMDE)
  • Johnson Thread Gages
  • Optical Comparators
  • RAM Optical Measuring Machine
  • SIP Measuring Machine

Performance Testing

Tests designed to evaluate the performance of samples, using devices such as reflectometers, elevated temperature, and pressure testing equipment.

  • Elevated Temperature Testing
  • Pressure Testing (Low PSI)
  • Spring Resiliency

Nondestructive Testing

Tests performed on a component that do not alter the physical state or destroy the sample, using devices such as scanning electron microscopy, radiography, and magnetic particle testers.

  • Alloy Detection
  • Eddy Current
  • Liquid Penetrant
  • Magnetic Particle
  • Radiography, Film/Cabinet Type
  • Ultrasound

 

Metallurgical

Complete wet and dry chemical composition, instrumental analysis of alloys, microstructure analysis, and hardness using a wide variety of metallurgical testing equipment.

  • Carbon & Sulfur Content of Steels
  • Elemental & Alloy Analysis
  • Hardness
  • Plating Thickness
  • Tensile & Ductility

Electrical Product Testing Center

Electrical Testing

A broad category of testing intended to verify that the electrical properties of an item meet the requirements specified. Specific types or capabilities of Electrical Testing include:

  • DNA MARKING - DNA marking consists of applying a DNA identifier to the surface of a microcircuit. A unique code, which can’t be replicated, re-engineered or digitally copied, is incorporated into the ink of the DNA mark.
  • DNA DETECTION – Used by supply chain security to detect electronic components that are potentially counterfeit.
  • DIELECTRIC WITHSTANDING VOLTAGE – Utilized to verify the capability of insulation on a component or exhibit.
  • ANTI-RESONATE FREQUENCYA test performed to measure at what frequency a minimum amplitude is achieved.
  • ATTENUATION Measures the amount of energy that is lost as the signal delivered arrives at the receiving end
  • BANDPASSUsed to measure wavelength transmission and blockage of certain wavelengths
  • CAPACITANCEAbility to test and inspect capacitors for change in electrical charge to the corresponding electrical potential
  • CONTACT BOUNCEMeasures bounce time which is utilized when designing interface circuitry for time delay             
  • CONTACT RESISTANCEUsed to measure the electrical resistance that occurs at the contact point where components are connected.
  • COUPLING Measures torque during the engagement or disengagement of connectors
  • DIELECTRIC WITHSTANDING VOLTAGEUsed to verify the capability of insulation
  • DIRECTIVITYVerifies the ration of leakage of signal to fully reflected signal
  • ELECTRICAL RESISTIVITYTests the electrical resistance of current on electrical resistors
  • ELECTROMECHANICAL DEVICESUsed to test compression and tension while inducing a current to ensure functionality.
  • ENDURANCE TESTINGUsed to test the endurance of exhibits while performing various tests to simulate the life of the exhibits.
  • EQUIVALENT SERIES RESISTANCEMeasures the loss of useful energy consisting of a resistor and an ideal capacitor, also know as internal resistance
  • FREQUENCY RESPONSETests the mechanical integrity of transformer cores, windings, and press frames in power transformers
  • GAIN – Tests the relationship between input amplitude and output amplitude of a circuit
  • IMPEDANCEVerifies that when an electrical fault occurs, there’s enough current to  operate a fuse or circuit breaker
  • INDUCTANCEVerifies non-symmetrical inductance using a frequency generation or an LCM multimeter
  • INSERTION LOSS Tests the signal of a fiber optic link in a way that mimics the transmission of data
  • INSULATION RESISTANCEMeasures the total resistance between two point separated by electrical insulation
  • LEAKAGE CURRENTMeasures the current flow through the protective ground conductor to the ground
  • MODULATION DISTORTIONMeasures third order intermodulation distortion in predetermined frequency channels            
  • OPERATE TIMEMeasures the time interval from the instant of coil-power application until completion of the last contact function
  • Q-FACTORMeasures the ratio of the resonance’s center frequency to it’s half-power bandwidth
  • RELEASE TIMEMeasures operate time, operate bounce time, release time, release bounce time, and maximum frequency.
  • RESISTANCEMeasures total resistance between two points separated by electrical insulation
  • RESONATE FREQUENCYMeasures the frequency at which data transfer reaches its maximum value
  • SPURIOUS EMISSION – Measures any transmitted signal outside of the assigned channel
  • TEMPERATURE TESTINGdetermines the ability of parts to function properly in an extremely cold or hot environment
  • TRANSCONDUCTANCEMeasures the current through the output of a device to the voltage across the input (ie the reciprocal of resistance)
  • TRIP TIME Measures the time taken for a residual circuit current device to cut power off when a fault occurs
  • VOLTAGE DROPA method to locate high resistance problems in circuits
  • VOLTAGE STANDING WAVE RADIOTests the process of sending radio frequencies through a cable to detect if there is any change in the frequency that pass through.

Types of Tested Devices

  • Acoustic Devices
    • Headsets
    • Microphones
  • Attenuators
  • Capacitors
  • Circuit Boards
  • Circuit Breakers
  • Connectors
  • Contacts
  • Couplers
  • Crystals/Oscillators
  • Discrete Semiconductors
    • Diodes
    • Thyristors
    • Transistors
  • Electronic Measuring & Test Equipment
  • Filters
  • Fuses
  • Microcircuits
    • Digital
    • Linear
  • Relays
  • Resistors
  • RF Microwave Devices
  • Switches
    • Pressure
    • Thermal
  • Transformers
  • Tubes
  • Wire and Cable

Environmental Simulation / Reliability Testing

Tests performed that simulate environmental conditions that a component will be exposed to (i.e., mechanical shock, thermal shock, vibration, etc.).

  • Barometric Pressure
  • Burn-in, Dynamic/Static
  • Constant Acceleration
  • Electromechanical Life
  • High Temp Life
  • Humidity
  • Immersion Life
  • Insertion/Extraction Forces
  • Intermittent Life
  • Mechanical Shock
  • Moisture Resistance
  • Salt Atmosphere
  • Salt Spray
  • Solderability
  • Steady-State Life
  • Temperature Cycling
  • Thermal Shock
  • Vibration, Random

Destructive Physical Analysis

A systematic, logical, detailed examination of a component, including examination of various states of physical disassembly, to identify problems or discrepancies and their probable cause.

  • Bond Pull
  • Design Verification
  • Die Shear
  • External Visual
  • Hermetic Seal, Fine Leak/Gross Leak (Bubble Testing and NID)
  • Lead Fatigue
  • Internal Visual
  • Particle Impact Noise Detection
  • Radiography, Film/Cabinet Type Fluoroscopy

Failure Analysis

A detailed examination of a failed device that usually consists of a series of nondestructive and destructive tests to determine the failure mode.

  • Bond Pull
  • Die Shear
  • Hermetic Seal, Fine Leak/Gross Leak (Bubble Testing & NID)
  • Internal Water Vapor Analysis
  • Lead Fatigue
  • Material Analysis (EDS)
  • Micromanipulation
  • Particle Impact Noise Detection
  • Radiography, Film/Cabinet Type/Real-Time
  • Scanning Electron Microscopy
  • Terminal Strength

Materials Analysis

A qualitative or quantitative analysis performed to determine the material composition of a component by identifying chemical elements within the component.

  • Elemental & Alloy Analysis
  • Material Analysis (EDS)
  • Plating Thickness
  • Scanning Electron Microscopy
  • Tensile

Qualification Testing

Approved to conduct qualification testing to selected Military Specifications.

  • Fiber Optic Testing, Interoperability
  • MIL-STD-202
  • MIL-STD-1344
  • MIL-STD-750
  • MIL-STD-883

Nondestructive Testing

Tests designed to evaluate the performance of a device.

  • Radiography

Other

Analytical / Chemical PTC

Located at DLA Troop Support, it tests materials in the harshest conditions to ensure their performance in the field.

  • Textiles Testing - complete testing for chemical and physical properties of textile end items and components
  • Environmental Testing - quantitative and qualitative analysis of finishes, material identification and pH testing
  • Metallurgical Testing - dimensional and microscopic surface measurements utilizing instrumentation such as coordinate measuring machines, optical comparator and metallograph, complete wet chemical and instrumental analysis of alloys
  • Reagent/Chemical Testing - shelf-life testing of chemicals and routine analysis of compounds and reagents for purity
  • Color Science Evaluations - instrumental and visual color evaluations
  • Optical Testing - measurement of optical properties
  • IFF/NIR Testing - force protection testing   
  • Other Testing - includes leather, paper, rubber, plastics and more

Nondestructive Testing

  • Alloy Detection 
  • External Visual 
  • Liquid Penetrant 
  • Magnetic Particle 
  • Radiography 

Environmental Testing

  • Hazardous Waste Characterization
  • Inorganic Analysis
  • PCB's
  • Pesticides
  • Semivolatile Organic
  • Spectrophotometric Identification & Quantitation
  • Toxicity Characteristics Leaching Procedure
  • Volatile Organic
  • Wet Chemical Methods

Environmental Simulation

  • Barometric Pressure
  • Burn-in, Dynamic/Static
  • Constant Acceleration
  • Electromechanical Life
  • High Temp Life
  • Humidity
  • Immersion Life
  • Insertion/Extraction Forces
  • Intermittent Life
  • Mechanical Shock
  • Moisture Resistance
  • Salt Atmosphere
  • Salt Spray
  • Solderability
  • Steady-State Life
  • Temperature Cycling
  • Thermal Shock
  • Vibration, Random

Other Services

  • Fixturing Shop Services
  • Reverse Engineering
  • Calibration
  • Training
  • Consultations/Technical Support