Electronics Product Center Test Capabilities List

  • ELECTRICAL
    • Anti-Resonate Frequency
    • Attenuation
    • Bandpass
    • Capacitance
    • Contact Bounce
    • Contact Resistance
    • Coupling
    • Dielectric Withstanding Voltage
    • Directivity
    • Electrical Resistivity
    • Electromechanical Devices
    • Endurance Testing
    • Equivalent Series Resistance
    • Frequency Response
    • Gain
    • Impedance
    • Inductance
    • Insertion Loss
    • Insulation Resistance
    • Leakage Current
    • Memory Devices
    • Modulation Distortion
    • Operate Time
    • Q-Factor
    • Release Time
    • Resistance
    • Resonate Frequency
    • Spurious Emission
    • Temperature Testing
    • Transconductance
    • Trip Time
    • Voltage Drop
    • Voltage Standing Wave Radio
  • TYPES OF TESTED DEVICES
    • Acoustic Devices
      • Headsets
      • Microphones
    • Attenuators
    • Capacitors
    • Circuit Boards
    • Circuit Breakers
    • Connectors
    • Contacts
    • Couplers
    • Crystals/Oscillators
    • Discrete Semiconductors
      • Diodes
      • Thyristors
      • Transistors
    • Electronic Measuring & Test Equipment
    • Filters
    • Fuses
    • Microcircuits
      • Digital
      • Linear
    • Relays
    • Resistors
    • RF Microwave Devices
    • Switches
      • Pressure
      • Thermal
    • Transformers
    • Tubes
    • Wire and Cable

  • ENVIRONMENTAL SIMULATION / RELIABILITY TESTING
    • Barometric Pressure
    • Burn-in
      • Dynamic
      • Static
    • Constant Acceleration
    • Electromechanical Life
    • High Temp Life
    • Humidity
    • Immersion Life
    • Insertion/Extraction Forces
    • Intermittent Life
    • Mechanical Shock
    • Moisture Resistance
    • Salt Atmosphere
    • Salt Spray
    • Solderability
    • Steady-State Life
    • Temperature Cycling
    • Thermal Shock
    • Vibration
      • Random
  • DESTRUCTIVE PHYSICAL ANALYSIS
    • Bond Pull
    • Design Verification
    • Die Shear
    • External Visual
    • Hermetic Seal
      • Fine Leak
      • Gross Leak (Bubble Testing and NID)
    • Lead Fatigue
    • Internal Visual
    • Particle Impact Noise Detection
    • Radiography
      • Film/Cabinet Type Fluoroscopy
  • FAILURE ANALYSIS
    • Bond Pull
    • Die Shear
    • Hermetic Seal
      • Fine Leak
      • Gross Leak (Bubble Testing & NID)
    • Internal Water Vapor Analysis
    • Lead Fatigue
    • Material Analysis (EDS)
    • Micromanipulation
    • Particle Impact Noise Detection
    • Radiography
      • Film/Cabinet Type
      • Real-Time
    • Scanning Electron Microscopy
    • Terminal Strength
  • MATERIALS ANALYSIS
    • Elemental & Alloy Analysis
    • Material Analysis (EDS)
    • Plating Thickness
    • Scanning Electron Microscopy
    • Tensile
  • QUALIFICATION TESTING
    • Fiber Optic Testing
      • Interoperability
    • MIL-STD-202
    • MIL-STD-1344
    • MIL-STD-750
    • MIL-STD-883
  • NONDESTRUCTIVE TESTING
    • Radiography

Last Updated:   29 Sep 2015